- $GOOGL has expanded its TPU customer base to nearly 100. - $ORCL plans to offer Google TPUs through OCI starting in 2027. - Counterpoint Research forecasts a 35-fold increase in HBM bit demand for AI ASICs from 2024 to 2028. - Average HBM capacity per AI ASIC is projected to increase approximately fivefold over the same period. - Samsung Electronics ($005930) and SK hynix ($000660) reportedly supply HBM for Google TPUs. - $AVGO maintains a long-term agreement to develop and supply Google's next-generation TPUs through 2031. - Reports suggest $GOOGL could expand direct HBM procurement, but the scale of the transition and a 15–20% cost reduction target remain unconfirmed. > TPU commercialization diversifies HBM demand beyond $NVDA, creating new growth opportunities for $005930 and $000660. > Direct HBM procurement could strengthen $GOOGL's purchasing leverage while putting pressure on memory suppliers' ASPs and margins. > The key distinction is between reducing $AVGO's procurement role and replacing its TPU design partnership. > Investors should monitor not only TPU shipments but also HBM capacity per TPU and changes in supplier market share.
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